| Capacitance Range | 0.001uF2.2uF | 1KHz ,1.0Vrms ,20 |
| Capacitance Tolerance | 5%(J), 10%(K), 20%(M) | 1KHz ,1.0Vrms ,20 |
| Rated Voltage | 250V/450V/630V/800V/1000V/1250V/1600V/2000VDC | |
| Climatic Category | 40/110 | |
| Operating Temperature | -40+110 | |
| Passive Flammability Class | UL94-V0 | |
| Dissipation Factor (tan) | C0.47 F: 0.10% (1KHz)
0.47 F<C1.0 F: 0.10% (1KHz)
C>1.0 F: 0.10% (1KHz)
C0.47 F: 0.20% (10KHz)
0.47 F<C1.0 F: 0.40% (10KHz)
C>1.0 F: 0.80% (10KHz)
C0.47 F: 0.60% (100KHz) | |
| Insulation Resistance (IR) | C0.33 F: IR10000MUf (60s,20)
C0.33 F: IR50000M (60s,20)
Ur100V,100VDC: IR10000s (60S,20) | |
| Withstand Voltage (Between Terminals) | 2Ur+1500V(a.c) 60s 2000V(a.c) 60s | (No permanent breakdown or flashover) |
| Withstand Voltage (Between Terminals and Case) | 1.6Ur(d.c) 60s | (No permanent breakdown or flashover) |
| MAX. Pulse rise time (dv/dt) | 600V/us, 500V/us, 400V/us, 200V/us, 150V/us, 100V/us | |
| Lead spacing | 7.5mm, 10mm, 15mm, 22.5mm, 27.5mm, 37.5mm | |
| Solderability | At least 95% of the Circumference of the Lead wire.Around load surface dipped into new solder, the body be no visible damage. | Solder temp: 2355, Immersion time: 2.00.5S |
| Resistance to Soldering heat | C/C5%, tg <0.0080 (CR1.0 F) / tg <0.0050 (CR>1.0 F) at 1KHZ, R/R50% | Solder temp: 2605, Immersion time: 101S, Recovery time 1-2 hours |
| Endurance | C/C10%, tg <0.0080 (CR1.0 F) / tg <0.0050 (CR>1.0 F) at 1KHZ, R/R50% | Temp: 1103, Duration: 1000+48h, Voltage: 1.25 Ur(a.c.)50hz, Recovery time at least 16 hours |
| Damp Heat (Steady State) | C/C5%, tg <0.0080 (CR1.0 F) / tg <0.0050 (CR>1.0 F) at 1KHZ | Temp: 402, Humidity: 90-95%RH, Duration: 56 day, No voltage applied, Recovery time 1-2 hours |
