| Capacitance Range | 0.001uF2.2uF | 1KHz ,1.0Vrms ,20 |
| Capacitance Tolerance | 5%(J), 10%(K), 20%(M) | 1KHz ,1.0Vrms ,20 |
| Rated Voltage | 630V/800V/1000V/1200V/1250V/1600V/2000VDC | |
| Climatic Category | -40+110 | |
| Dissipation Factor | C0.47F: 0.10%
0.47F<C1.0F: 0.10%
C>1.0F: 0.10% | 1KHZ |
| Insulation Resistance | C0.33F: IR50000M
C0.33F: IR10000sUf or 10000MUf | Ur100V,100VDC, 60s,20 |
| Withstand voltage (Between Terminals) | 2000V(a.c) 60s | 2Ur+1500V(a.c) |
| Withstand voltage (Between Terminals and Case) | (No permanent breakdown or flashover) | 1.6Ur(d.c) 60s |
| MAX. Pulse rise time | 150v/us | |
| Lead spacing | 7.5mm, 10mm, 15mm, 22.5mm, 27.5mm, 37.5mm | |
| Flame Retardant Class | UL94-V0 | |
| Solderability | At least 95% of the Circumference of the Immersion time Lead wire.Around load surface dipped into with new soler, the body be no visible damage. | Solder temp: 2355, Immersion time: 2.00.5S |
| Resistance to Soldering heat | No permanent breakdown or flashover | Solder temp: 2605, Immersion time: 101S |
| Endurance | Capacitance Variation: C/C10%, Dissipation Factor: tg<0.0080 (CR1.0F), tg<0.0050 (CR>1.0F) at 1KHZ, Withstand Voltage: 1.6 UR (d.c) 60S, Insulation Resistance: R/R50% | Temp: 1103, Duration: 1000+48h, Applied voltage: 1.25 Ur(a.c.)50hz |
| Damp Heat (Steady State) | Capacitance Variation: C/C5%, Dissipation Factor: tg<0.0080 (CR1.0F), tg<0.0050 (CR>1.0F) at 1KHZ, Withstand Voltage: 1.6 UR (d.c) 60S, Insulation Resistance: R/R50% | Temp: 402, Humidity: 90-95%RH, Duration: 56 day |
| Dry Heat | Capacitance Variation: C/C5%, Dissipation Factor: tg<0.0080 (CR1.0F), tg<0.0050 (CR>1.0F) at 1KHZ, Withstand Voltage: 1.6 UR (d.c) 60S, Insulation Resistance: R/R50% | Temp: 1102, Duration: 16h |
