| 1 | Drop | Free drop from 55cm height onto a wooden board, 3 times | Frequency change within 5ppm, resistance change within 15% before and after test |
| 2 | Vibration | Frequency: 10~55Hz, Amplitude: 1.5mm, Duration: 2 hours per each of the three directions (X, Y, Z) | Frequency change within 5ppm, resistance change within 15% before and after test |
| 3 | Thermal Shock | 25 cycles of high and low temperature in a test chamber. Low temp: -403 for 30 min, High temp: 852 for 30 min. Transition time: 3 min between temps. | Frequency change within 5ppm, resistance change within 15% before and after test |
| 4 | Hermeticity | Helium pressure: 50.5Kg/cm, Helium pressurization time: 120 minutes | Leak rate: 110-9Pa.m3/s |
| 5 | Resistance to Soldering Heat | Wave crest temperature: 260C10C, Duration: 155 seconds | Frequency change within 5ppm, resistance change within 15% before and after test |
| 6 | Solderability Test | Temperature: 260C10C, Immersion time: 31 seconds | Soldered area coverage of pins: 90% |
| 7 | High Temperature and Humidity | Temperature: 60C2C, Humidity: 90%~95%, Duration: 240 hours | 1. Frequency change within 5ppm, resistance change within 15% before and after test. 2. Product surface should not be rusted. |
| 8 | High Temperature Test | Temperature: 85C2C, Duration: 240 hours | Frequency change within 5ppm, resistance change within 15% before and after test |
| 9 | Low Temperature Test | Temperature: -40C2C, Duration: 240 hours | Frequency change within 5ppm, resistance change within 15% before and after test |
| 10 | Life Test | Voltage: 5V, Temperature: 25, Duration: 1000 hours | Frequency change within 5ppm, resistance change within 15% before and after test |
