| 1 | Drop | Free fall from 55cm height onto a wooden board, 3 times. | Frequency change within 5ppm, resistance change within 15% before and after test. |
| 2 | Vibration | Frequency: 10~55Hz, Amplitude: 1.5mm. Duration: 2 hours for each of the three directions (X, Y, Z). | Frequency change within 5ppm, resistance change within 15% before and after test. |
| 3 | Thermal Shock | 25 cycles of high and low temperature in a test chamber. Low temp: -403C for 30 min, High temp: 852C for 30 min. Transition time: 3 minutes between temperatures. | Frequency change within 5ppm, resistance change within 15% before and after test. |
| 4 | Hermeticity | Helium pressure: 50.5 Kg/cm, Helium pressurization time: 120 minutes. | Leak rate: 110-9 Pa.m/s |
| 5 | Resistance to Soldering Heat | Wave crest temperature: 260C10C, Time: 155 seconds. | Frequency change within 5ppm, resistance change within 15% before and after test. |
| 6 | Solderability Test | Temperature: 260C10C, Immersion time: 31 seconds. | Solder-covered area of the pins 90%. |
| 7 | High Temperature and High Humidity | Temperature: 60C2C, Humidity: 90%~95%, Duration: 240 hours. | 1. Frequency change within 5ppm, resistance change within 15% before and after test. 2. Product surface should not be rusted. |
| 8 | High Temperature Test | Temperature: 85C2C, Duration: 240 hours. | Frequency change within 5ppm, resistance change within 15% before and after test. |
| 9 | Low Temperature Test | Temperature: -40C2C, Duration: 240 hours. | Frequency change within 5ppm, resistance change within 15% before and after test. |
| 10 | Life Test | Voltage: 5V, Temperature: 25, Duration: 1000 hours. | Frequency change within 5ppm, resistance change within 15% before and after test. |
