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performance chip high frequency inductors FH VHF100505HQ2N4BT with precise electrical characteristics

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performance chip high frequency inductors FH VHF100505HQ2N4BT with precise electrical characteristics

Current Rating : 800mA

Inductance : 2.4nH

Frequency - Self Resonant : 6GHz

DC Resistance(DCR) : 100mΩ

Type : Multilayer inductor;High-frequency inductor

Q @ Frequency : 8@100MHz

Description : 800mA 2.4nH 100mΩ 0402 Fixed Inductors RoHS

Mfr. Part # : VHF100505HQ2N4BT

Model Number : VHF100505HQ2N4BT

Package : 0402

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Product Overview

The VHF100505HQ Series Chip High Frequency Inductors are designed for high-frequency applications. These multilayer ceramic inductors offer reliable performance with precise electrical characteristics. They are suitable for various electronic circuits requiring compact and efficient inductance solutions.

Product Attributes

  • Product Type: Chip high frequency inductors
  • Material: Ceramic body (Al2O3), Inner electrode (Pure Silver Ag), Terminal electrode (Silver Ag layer, Nickel-Sn plating)
  • Plating: Ni/Sn
  • Certifications: RoHS compliant (for "Unitary lead free" products)

Technical Specifications

Part Number Prefix Series Dimensions (L x W x T) Tolerance Options Inductance Range Material Code
VHF 100505HQT 1.0 x 0.5 x 0.5 mm (0.040 x 0.020 x 0.020 inches) B (0.1nH), C (0.2nH), S (0.3nH), G (2%), H (3%), J (5%) 1.0 nH to 330 uH (Refer to Electrical Characteristics List) HQ

Electrical Characteristics List (VHF100505HQ Series)

Part NO. Inductance (nH) Q Value (min) DCR () max Test Frequency (MHz) Test Voltage (mV) SRF (MHz) min Rated Current (mA) max
VHF100505HQ1N0T 1.0 8 0.06 100 50 10000 1000
VHF100505HQ1N1T 1.1 8 0.07 100 50 10000 1000
VHF100505HQ1N2T 1.2 8 0.07 100 50 10000 1000
VHF100505HQ1N3T 1.3 8 0.07 100 50 10000 1000
VHF100505HQ1N5T 1.5 8 0.08 100 50 6000 1000
VHF100505HQ1N6T 1.6 8 0.08 100 50 6000 1000
VHF100505HQ1N8T 1.8 8 0.08 100 50 6000 900
VHF100505HQ2N0T 2.0 8 0.09 100 50 6000 900
VHF100505HQ2N2T 2.2 8 0.09 100 50 6000 900
VHF100505HQ2N4T 2.4 8 0.10 100 50 6000 800
VHF100505HQ2N7T 2.7 8 0.12 100 50 6000 800
VHF100505HQ3N0T 3.0 8 0.12 100 50 6000 800
VHF100505HQ3N3T 3.3 8 0.13 100 50 6000 800
VHF100505HQ3N6T 3.6 8 0.15 100 50 4000 700
VHF100505HQ3N9T 3.9 8 0.16 100 50 4000 700
VHF100505HQ4N3T 4.3 8 0.16 100 50 4000 700
VHF100505HQ4N7T 4.7 8 0.16 100 50 4000 700
VHF100505HQ5N1T 5.1 8 0.16 100 50 4000 600
VHF100505HQ5N6T 5.6 8 0.20 100 50 4000 600
VHF100505HQ6N2T 6.2 8 0.20 100 50 3900 600
VHF100505HQ6N8T 6.8 8 0.20 100 50 3900 600
VHF100505HQ7N5T 7.5 8 0.24 100 50 3700 500
VHF100505HQ8N2T 8.2 8 0.24 100 50 3600 500
VHF100505HQ9N1T 9.1 8 0.26 100 50 3400 500
VHF100505HQ10NT 10 8 0.26 100 50 3200 500
VHF100505HQ12NT 12 8 0.50 100 50 2700 400
VHF100505HQ15NT 15 8 0.50 100 50 2300 400
VHF100505HQ18NT 18 8 0.60 100 50 2100 350
VHF100505HQ20NT 20 8 0.60 100 50 2000 350
VHF100505HQ22NT 22 8 0.60 100 50 1900 350
VHF100505HQ27NT 27 8 0.70 100 50 1600 300
VHF100505HQ33NT 33 8 0.80 100 50 1300 300
VHF100505HQ39NT 39 8 1.00 100 50 1200 250
VHF100505HQ43NT 43 8 1.10 100 50 1100 250
VHF100505HQ47NT 47 8 1.10 100 50 1000 250
VHF100505HQ56NT 56 8 1.20 100 50 750 200
VHF100505HQ68NT 68 8 1.40 100 50 750 200
VHF100505HQ82NT 82 8 1.60 100 50 750 200
VHF100505HQR10T 100 8 2.00 100 50 700 200
VHF100505HQR12T 120 8 2.50 100 50 600 150
VHF100505HQR15T 150 8 3.00 100 50 550 150
VHF100505HQR18T 180 8 3.50 100 50 500 150
VHF100505HQR22T 220 8 3.70 100 50 450 100
VHF100505HQR27T 270 8 4.50 100 50 400 100
VHF100505HQR33T 330 6 5.00 50 50 350 80

Reliability Testing Items

No. Item Requirements Test Methods and Remarks
1 Operating Temperature Range -55+125
2 Solder ability At least 95% of terminal electrode should be covered with solder. Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth: 10mm; Duration: 51s; Dip performance to a flux of about: 3 ~ 5 s
3 Resistance to Soldering At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance: HQ: change within 10%; Q value change(ceramic): within 20% Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth: 10mm; Duration: 101s; Dip performance to a flux of about: 3 ~ 5 s
4 Adhesion of electrode The termination and body should be no damage. Applied force: 5N for 1005 series. Keep time: 101S
5 Low temperature resistance No mechanical damage. Inductance change: within 10%; Q value change(ceramic): within 20% Temperature: -552; Testing time: 1000+240/-0 h
6 Bending strength No mechanical damage. Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s
7 Vibration No mechanical damage. Inductance change: within 10%; Q value change(ceramic): within 20% Amplitude modulation: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min.
8 High temperature resistance No mechanical damage. Inductance change: within 10%; Q value change(ceramic): within 20% Testing time: 1000+240/-0 h; Temperature: 1252
9 Static Humidity No mechanical damage. Inductance change: within 10%; Q value change(ceramic): within 20% Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000+240/-0 h
10 High temperature load No mechanical damage. Inductance change: within 10%; Q value change(ceramic): within 20% Impose current: rated current; Testing time: 1000+240/-0 h; Temperature: 1252
11 Temperature Shock No mechanical damage. Inductance change: within 10%; Q value change(ceramic): within 20% Temperature: -55 for 303min +125 for 303min; Number of cycles: 100

Note: When there are questions concerning measurement, it shall be made after 242hrs of recovery under the standard condition.

Product Packaging

Size Pieces per Reel Pieces per Box Pieces per Case
100505 10000 100000 600000

Recommended Soldering Conditions

Reflow Soldering:

  • Pre-heating: Temperature difference between product surface and solder temperature should not exceed 150.
  • Cooling: Temperature difference between product surface and solvent temperature should not exceed 100.
  • Products should be soldered within the allowable range indicated by the reflow soldering profile curve.

Manual Soldering:

  • Soldering Iron Temperature: 350 (Max)
  • Power: 30W (Max)
  • Soldering Time: < 5S (Avoid applying the tip of the soldering iron to the terminal electrodes).

Cleaning

  • Cleaning Temperature: 60 (Max)
  • Cleaning Time: 1 minute (Min)
  • Ultrasonic Power: 200W (Max)

Storage Requirements

  • Storage Period: Within 1 year from the factory inspection date. If exceeded, check solderability before use.
  • Storage Conditions:
    • Warehouse Temperature: -10 to +40
    • Relative Humidity: 30% to 70%
    • Avoid corrosive substances (sulfur, chlorine gas, acid).
    • Store on pallets to prevent influence from humidity and dust.
    • Avoid heat shock, vibration, and direct sunlight.
    • Products should be stored in airtight packaging.

Usage Of ODS (Ozone Depleting Substances)

The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in its production process.

Notes

  • If the product is labeled "Unitary lead free", it complies with RoHS directive requirements.
  • This product specification guarantees the quality of our product as a single unit. Please ensure your product has been evaluated and confirmed against your specifications when our product is mounted to your product.
  • The company cannot warrant against failure caused by any use of our product that deviates from the intended use as described in this product specification.

2410121256_FH-VHF100505HQ2N4BT_C3032806.pdf


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