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T core molding power inductors LanTu Micro STC201610-2R2MT designed for high switching frequency applications

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T core molding power inductors LanTu Micro STC201610-2R2MT designed for high switching frequency applications

Current - Saturation (Isat) : 2.8A

Description : 2.8A 0806 Fixed Inductors RoHS

Mfr. Part # : STC201610-2R2MT

Model Number : STC201610-2R2MT

Package : 0806

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T-core Molding Structure Power Inductors

Product Overview
SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. presents the STC201610 series of T-core molding structure power inductors. These inductors feature a thin design with low DC resistance and ultra-high current capabilities. Their magnetic shielding provides strong anti-electromagnetic interference, making them suitable for high-density installations. The T-core molding structure ensures high reliability and excellent vibration resistance. With extremely low DCR and ultra-low AC losses, these inductors are ideal for high switching frequency applications. They are RoHS, Halogen Free, and REACH compliant.

Applications
These power inductors are designed for DC/DC converters in notebook PC CPUs, mobile phones, tablets, HDDs, DVCs, PDAs, 5G modules, servers, base stations, and various other DC-DC conversion power modules.

Product Attributes

Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
Product Type: T-core molding Structure Power Inductors
Certifications: RoHS, Halogen Free, REACH Compliance
Origin: Shenzhen, China

Technical Specifications

General Specifications

Parameter	Value
Operating Temperature	-40 to +125 (Including coils self-temperature rise)
Test Equipment (Inductance)	WK3260B LCR meter or equivalent
Test Equipment (Current)	WK3260B+WK3265B or equivalent
Test Equipment (DCR)	Chroma 16502 or equivalent

Product Identification

Format: STC 201610 - [Inductance Value] [Tolerance] [Packing]

Component	Description
STC	Type (T-CORE molding Structure Power Inductors)
201610	External Dimensions (LWH) in mm (2.01.61.0)
[Inductance Value]	e.g., 1.0uH
[Tolerance]	J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
[Packing]	B: Bulk Package, T: Tape & Reel

Shape and Dimensions

Part No.	A (mm)	B (mm)	C (mm)	D (mm)	E (Typ) (mm)	F (Typ) (mm)	H (Typ) (mm)
STC201610	2.00.2	1.60.2	1.0Max	0.70.2	2.1	0.5	1.7

Electrical Characteristics (STC201610 Series at 25)

Part No.	Inductance (H) @ 1MHz, 1.0V	Tol	DCR (m)		Saturation Current (A)		Heat Rating Current (A)
			Typical	Max	Typical	Max	Typical	Max
STC201610-R22M	0.22	20%	11	18	8.2	7.5	6.9	6.3
STC201610-R47M	0.47	20%	22	25	6.3	5.5	5.5	5.0
STC201610-1R0M	1.0	20%	35	43	4.6	4.2	4.5	4.1
STC201610-1R5M	1.5	20%	80	100	3.2	2.9	2.6	2.3
STC201610-2R2M	2.2	20%	120	130	3.0	2.8	2.5	2.1
STC201610-3R3M	3.3	20%	140	170	2.3	2.0	1.7	1.5
STC201610-4R7M	4.7	20%	190	220	2.0	1.8	1.6	1.4
STC201610-100M	10	20%	483	580	1.4	1.1	1.0	0.7

Notes on Currents:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat and Irms.
- Special remind: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Packaging Specifications

Part No.	Tape Dimension W (mm)	Tape Dimension P (mm)	Tape Dimension W1 (mm)	Reel Dimensions A (mm)	Reel Dimensions B (mm)	Reel Dimensions C (mm)	Reel Dimensions D (mm)	Reel (PCS)	Inside Box (PCS)	Outside Carton (PCS)
STC201610	8	4	3.5	8.4	60	13	178	3000	30,000	120,000

Reliability Testing

Item	Requirements	Test Methods and Remarks
Terminal Strength (SMT)	Meet specified force and duration requirements without loose terminals.	Pulling test: Defined forces based on terminal cross-sectional area (A). e.g., A8mm, Force5N, Time:30sec. Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s. Ref: GB/T 2423.60-2008.
Terminal Strength (DIP)	Meet specified force and duration requirements without loose terminals.	Applied force based on terminal diameter (d). e.g., 0.35d0.50mm, Applied force:5N, Duration: 10sec. Pull Force applied gradually and maintained for 10 seconds. Ref: GB/T 2423.60-2008.
Resistance to Flexure	No visible mechanical damage.	Solder to test jig, apply force in specified direction. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. Ref: JIS C 5321:1997.
Dropping	No case deformation or change in appearance. No short and no open.	Drop packaged products from 1m height in 1 angle, 3 ridges and 6 surfaces, twice in each direction. Ref: GB/T 2423.7-2018.
Solderability	Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage.	Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol by weight. Ref: GB/T 2423.28-2005.
Vibration	No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.	Solder to jig, subjected to simple harmonic motion (amplitude 1.5mm, frequency 10-55 Hz). Applied for 2 hours in each of 3 mutually perpendicular directions (total 6 hours). Ref: GB/T 2423.10-2019.
Thermal Shock	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	100 cycles of temperature shock (-55~40 to 85~125). Transforming interval: Max. 20 sec. Stabilize at normal condition for 1~2 hours before measuring. Ref: GB/T 2423.22-2012 Method Na.
Low Temperature Storage	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	Temperature: -55~-402. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. Ref: GB/T 2423.1-2008 Method Ab.
High Temperature Storage	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	Temperature: 85~1252. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. Ref: GB/T 2423.2-2008 Method Bb.
Damp Heat (Steady States)	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. Ref: GB/T 2423.3-2016.
Heat Endurance of Reflow Soldering	No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%.	Perform reflow soldering twice according to recommended curve. Peak temperature: 260+0/-5. Ref: GJB 360B-2009.
Resistance to Solvent Test	No case deformation or change in appearance or obliteration of marking.	Dip parts into IPA solvent for 50.5 Min, dry at room temp for 5 Min, then brush 10 times. Ref: IEC 68-2-45:1993.
Overload Test	During test: no smoke, no peculiar smell, no fire. Characteristics normal after test.	Apply twice rated current for 5 minutes. Ref: JIS C5311-6.13.
Voltage Resistance Test	During test: no breakdown. Characteristics normal after test.	For parts with two coils: DC1000V, Current: 1mA, Time: 1Min. Ref: MIL-STD-202G Method 301.

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.

Reminders for Using These Products

Storage: Within 12 months. Conditions: 5~40C, 35~65% RH. Solderability may deteriorate beyond storage period.
Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
Handling: Avoid direct contact with terminals by bare hands due to oil secretions affecting soldering. Handle carefully to prevent damage from dropping or improper removal.
Terminals: Do not bend terminals excessively to avoid wire fracture.
Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
Magnetic Fields: Do not expose products to magnets or magnetic fields.
Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
Soldering Corrections: Perform after-mounting corrections within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
Thermal Design: Account for self-heating when power is ON. Ensure sufficient thermal design margin.
Non-Magnetic Shield Type: Careful layout is required on the circuit board to prevent malfunctions due to magnetic interference.

2410121647_LanTu-Micro-STC201610-2R2MT_C22468831.pdf

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