Molding SMD Power Inductors - SMS1350 Series
Product Overview
The SMS1350 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are ultra-high current SMD power inductors featuring a thin design with low DC resistance and exceptional current handling capabilities. These magnetically shielded inductors offer strong anti-electromagnetic interference, making them ideal for high-density installations. Their integral construction ensures high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. Designed for high efficiency, these inductors reduce winding DC resistance and core eddy-current loss, supporting frequencies up to 3MHz. They are RoHS, Halogen Free, and REACH compliant.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS1350
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Technical Specifications
Electrical Characteristics
| Part No | Inductance (H) @ 0A | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
| SMS1350-R36M | 0.36 | 20% | 0.85 | 1.1 | 60.00 | 41.00 |
| SMS1350-R47M | 0.47 | 20% | 1.1 | 1.3 | 52.00 | 39.00 |
| SMS1350-R68M | 0.68 | 20% | 1.2 | 1.5 | 40.00 | 32.00 |
| SMS1350-R82M | 0.82 | 20% | 1.5 | 1.7 | 42.00 | 30.00 |
| SMS1350-1R0M | 1.0 | 20% | 1.9 | 2.2 | 35.00 | 26.00 |
| SMS1350-1R5M | 1.5 | 20% | 2.7 | 3.2 | 30.00 | 23.00 |
| SMS1350-2R2M | 2.2 | 20% | 4.0 | 5.0 | 26.00 | 20.00 |
| SMS1350-3R3M | 3.3 | 20% | 7.0 | 9.0 | 22.00 | 15.00 |
| SMS1350-4R7M | 4.7 | 20% | 9.0 | 11.0 | 17.00 | 12.00 |
| SMS1350-6R8M | 6.8 | 20% | 15.0 | 18.0 | 14.00 | 11.00 |
| SMS1350-100M | 10 | 20% | 20.0 | 23.0 | 12.00 | 8.00 |
| SMS1350-150M | 15 | 20% | 28.0 | 32.0 | 10.00 | 6.00 |
| SMS1350-220M | 22 | 20% | 45.0 | 52.0 | 7.00 | 4.50 |
| SMS1350-330M | 33 | 20% | 66.0 | 75.0 | 6.00 | 4.00 |
| SMS1350-470M | 47 | 20% | 100.0 | 120.0 | 5.00 | 3.00 |
| SMS1350-680M | 68 | 20% | 115.0 | 135.0 | 4.50 | 2.50 |
General Specifications
| Parameter | Value |
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
| Frequency | Up to 3MHz |
| Absolute Maximum Voltage | 30VDC |
| Test Frequency (L, Isat & Irms) | 100KHz, 1.0V |
| Saturation Current Definition | DC current at which inductance drops 30% from its value without current. |
| Temperature Rise Current Definition | The actual value of DC current when the temperature rise is T 40 (Ta=25). |
| Rated DC Current Definition | The lesser value of Isat or Irms. |
Shape and Dimensions
| Part No | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | G (mm) | H (mm) |
| SMS1350 | 13.800.50 | 12.600.20 | 6.00Max | 3.70 Typ | 2.50 Typ | 8.00 | 14.60 | 5.00 |
Product Identification
Example: SMS 1350 100 M T
- SMS: Type (Molding SMD Power Inductor)
- 1350: Series & Dimensions (13.812.66.0 mm)
- 100: Inductance (10 H)
- M: Inductance Tolerance (20%)
- T: Packing (Tape & Reel)
Inductance Tolerance Codes
- J: 5%
- K: 10%
- L: 15%
- M: 20%
- P: 25%
- N: 30%
Packing Codes
- B: Bulk Package
- T: Tape & Reel
Packaging Specifications (Tape & Reel)
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
| SMS1350 | 24.0 | 16.0 | 11.5 | 24.4 | 100 | 13 | 330 | 500 | 1000 | 4000 |
Reliability Testing
Various reliability tests are performed, including Terminal Strength (SMT & DIP), Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low Temperature Storage, High Temperature Storage, Damp Heat (Steady States), Heat endurance of Reflow soldering, Resistance to solvent test, Overload test, and Voltage resistance test. Specific requirements and test methods are detailed in the original documentation.
Recommended Reflow Soldering Curve
Users should adjust and confirm reflow conditions based on their specific equipment and environment. The provided curve is a recommendation.
Reminders for Using These Products
- Storage: Within 12 months, under 5~40C and 35~65% RH.
- Environment: Avoid gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils. Handle carefully to prevent damage.
- Terminal Bending: Do not bend terminals excessively.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Keep away from magnets or magnetic objects.
- Preheating: Preheat before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions to avoid performance degradation.
- Thermal Design: Account for self-heating when power is on.
- Non-Magnetic Shield Type: Careful PCB layout is required to prevent malfunctions due to magnetic interference.
2410121635_LanTu-Micro-SMS1350-470MT_C5127442.pdf
|
|
Molding SMD Power Inductor LanTu Micro SMS1350-470MT Featuring Composite Structure and EMI Shielding Images
|
