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SMD Power Inductor LanTu Micro SMS1360-470MT Featuring Magnetic Shielding and High Frequency Support

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SMD Power Inductor LanTu Micro SMS1360-470MT Featuring Magnetic Shielding and High Frequency Support

Current - Saturation (Isat) : 6A

Description : 6A SMD,13.8x12.6mm Fixed Inductors RoHS

Mfr. Part # : SMS1360-470MT

Model Number : SMS1360-470MT

Package : SMD,13.8x12.6mm

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Molding SMD Power Inductors - SMS1360 Series

Product Overview
The SMS1360 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors designed for demanding applications. These inductors feature a thin profile with low DC resistance and ultra-high current capabilities. Their magnetic shielding provides strong anti-electromagnetic interference, making them ideal for high-density installations. Constructed with an integral molding structure, they offer high reliability and excellent vibration resistance, coupled with ultra-low buzz noise due to their composite construction. Utilizing low-loss alloy powder die-casting, they achieve low impedance and small parasitic capacitance, contributing to high efficiency by reducing winding DC resistance and core eddy-current loss. These inductors support frequencies up to 3MHz and have an absolute maximum voltage of 30VDC, while being RoHS, Halogen Free, and REACH compliant.

Applications
Suitable for PDA, notebook, desktop, and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.

Product Attributes

Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
Series: SMS1360
Type: Molding SMD Power Inductor
Compliance: RoHS, Halogen Free, REACH

Technical Specifications

Item	Specification	Details
General Features	Design	Thin profile, magnetic shielding, integral construction
	Noise Level	Ultra low buzz noise
	Frequency	Up to 3MHz
Electrical Characteristics	Absolute Maximum Voltage	30VDC
Environmental Data	Operating Temperature	-55 to +125 (Including coils self-temperature rise)
Environmental Data	Storage Conditions	Temperature: 5~40C, Humidity: 35 to 65% RH or less (within 12 months)
Test Equipment	Inductance (L)	WK3260B LCR meter or equivalent
Test Equipment	Saturation Current (Isat) & Heat Rating Current (Irms)	WK3260B+WK3265B or equivalent
Product Identification	Format	SMS 1360 [Inductance Value] [Tolerance] [Packaging]
Dimensions	External Dimensions (LWH)	13.812.67.0 mm (for SMS1360 series)
Dimensions	Recommended Land Pattern	Refer to diagram (dimensions provided in mm)
Electrical Characteristics (at 25)
Part No.	Inductance (H) @ 100KHz, 1.0V	Tolerance	DCR (m) Typical	Saturation Current (A) Typical	Heat Rating Current (A) Typical
SMS1360-R68M	0.68	20%	1.4	1.6	55.00
SMS1360-1R0M	1.0	20%	1.7	2.0	35.00
SMS1360-2R2M	2.2	20%	3.5	4.2	25.00
SMS1360-3R3M	3.3	20%	5.5	6.8	22.00
SMS1360-4R7M	4.7	20%	8.0	9.0	18.00
SMS1360-6R8M	6.8	20%	10.0	14.0	15.00
SMS1360-8R2M	8.2	20%	13.5	16.0	14.00
SMS1360-100M	10	20%	18.0	21.0	12.50
SMS1360-220M	22	20%	34.0	38.0	8.00
SMS1360-270M	27	20%	45.0	56.0	7.00
SMS1360-330M	33	20%	56.0	70.0	6.50
SMS1360-470M	47	20%	70.0	90.0	6.00
SMS1360-680M	68	20%	105.0	125.0	5.00
SMS1360-820M	82	20%	115.0	140.0	4.00
SMS1360-101M	100	20%	130.0	200.0	3.00
Inductance Tolerance Codes	J, K, L, M, P, N	5%, 10%, 15%, 20%, 25%, 30%
Packaging Codes	B, T	Bulk Package, Tape & Reel
Current Definitions	Saturation Current	DC current at which inductance drops 30% from its value without current.
	Heat Rating Current	DC current when the temperature rise is T 40 (Ta=25).
	Rated DC Current	The lesser value of Isat or Irms.

Packaging Information

Tape and Reel Specifications:

Part No.	Tape Dimension W (mm)	Tape Dimension P (mm)	Tape Dimension W1 (mm)	Reel Dimensions A (mm)	Reel Dimensions B (mm)	Reel Dimensions C (mm)	Reel Dimensions D (mm)	Reel Quantity (PCS)	Inside Box (PCS)	Outside Carton (PCS)
SMS1360	24.0	16.0	11.5	24.4	100	330	500	1000	4000

Tape Dimension: Refer to diagram (dimensions provided in mm).

Cover tape peel off condition:

Cover tape peel force: 10 to 120g
Noodle strip peeling angle: 165 to 180

Packing quantity: Refer to table above.

Reliability Testing

Item	Requirements	Test Methods and Remarks
Terminal Strength	Meet specified requirements without any loose terminal.	Pulling test (SMT/DIP), Solder paste thickness: 0.12mm (SMT). Force and duration vary based on terminal size.
Resistance to Flexure	No visible mechanical damage.	Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec.
Dropping	No case deformation or change in appearance. No short and no open.	Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability	Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. No visible mechanical damage.	Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol.
Vibration	Inductance change: Within 10%. Q factor change: Within 20%. No visible mechanical damage.	Simple harmonic motion, 10 to 55 Hz, total amplitude 1.5mm. Applied for 2 hours in each of 3 mutually perpendicular directions.
Thermal Shock	Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. No visible mechanical damage.	100 cycles of temperature shock between (85~125) and (-55~40). Transforming interval: Max. 20 sec.
Low temperature Storage	Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. No visible mechanical damage.	Temperature: -55~-402. Duration: 962 hours.
High temperature Storage	Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. No visible mechanical damage.	Temperature: 125~852. Duration: 962 hours.
Damp Heat (Steady States)	Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. No visible mechanical damage.	Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours.
Heat endurance of Reflow soldering	L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. No significant defects in appearance.	Reflow soldering twice. Peak temperature: 260+0/-5.
Resistance to solvent test	No case deformation or change in appearance or obliteration of marking.	Dip parts into IPA solvent for 50.5Min, drying for 5Min, brushing 10 times.
Overload test	During the test no smoke, no peculiar smell, no fire. Characteristics are normal after test.	Apply twice the rated current for 5 minutes.
Voltage resistance test	During the test no breakdown. Characteristics are normal after test.	DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils)

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.

Reminders for Using These Products

Storage: Within 12 months, under 5~40C and 35~65% RH.
Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
Handling: Avoid direct contact with terminals by bare hands. Handle products carefully to prevent damage.
Terminal Bending: Do not bend terminals with excessive stress.
Cleaning: Do not rinse coils; contact manufacturer if cleaning is necessary.
Magnetic Fields: Do not expose products to magnets or magnetic fields.
Preheating: Ensure preheating before soldering; temperature difference between solder and chip should not exceed 150C.
Soldering Corrections: Perform within specified conditions; overheating may cause issues.
Thermal Design: Allow sufficient margin for self-heating when power is on.
Non-Magnetic Shield Type: Careful layout is required to prevent malfunction due to magnetic interference.

2410121647_LanTu-Micro-SMS1360-470MT_C5127452.pdf

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