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LanTu Micro SMS0850 4R7MT ultra high current inductor for PDA notebook and server power applications

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LanTu Micro SMS0850 4R7MT ultra high current inductor for PDA notebook and server power applications

Current - Saturation (Isat) : 12A

Description : 12A SMD,8.5x8mm Fixed Inductors RoHS

Mfr. Part # : SMS0850-4R7MT

Model Number : SMS0850-4R7MT

Package : SMD,8.5x8mm

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Product Overview

The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0850 Series are ultra-high current SMD power inductors designed for high-density installation. These magnetically shielded inductors offer strong anti-electromagnetic interference capabilities, low DC resistance, and ultra-high current thin design. Featuring an integral construction for high reliability and vibration resistance, they also provide ultra-low buzz noise due to their composite structure. Manufactured using low-loss alloy powder die-casting, they exhibit low impedance and small parasitic capacitance, contributing to high efficiency by reducing eddy-current loss. These inductors operate at frequencies up to 1-2MHz and have an absolute maximum voltage of 30VDC. They are RoHS, Halogen Free, and REACH compliant.

Product Attributes

Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
Product Type: Molding SMD Power Inductor
Series: SMS0850
Certifications: RoHS, Halogen Free, REACH Compliance

Applications

PDA, notebook, desktop, server applications
High current POL converters
Battery powered devices
DC/DC converters in distributed power systems

Technical Specifications

Environmental Data

Parameter	Value
Operating Temperature	-55 to +125 (Including coils self-temperature rise)

Product Identification

Format: SMS 0850 [Inductance Code] [Tolerance Code] [Packing Code]

Type: SMS (Molding SMD Power Inductor)
External Dimensions: 0850 (8.5 x 8.0 x 5.0 mm)
Inductance: e.g., 100 (10 uH)
Tolerance Code: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing Code: B (Bulk Package), T (Tape & Reel)

Shape and Dimensions

Part No.	A (mm)	B (mm)	C (mm)	D (mm)	E (mm)	F (mm)	G (mm)	H (mm)
SMS0850	8.50.50	8.00.30	5.00 Max	3.0 0.30	1.8 0.30	4.5	9.5	3.5

Recommended Land Pattern Dimensions are in mm.

Specifications (Electrical Characteristics at 25)

Part No.	Inductance (H)	L @ 100KHz, 1.0V Tol.	DCR (m) Typical	DCR (m) Max	Saturation Current (A) Typical	Heat Rating Current (A) Typical
SMS0850-R56M	0.56	20%	3.0	4.5	30.00	24.00
SMS0850-R68M	0.68	20%	3.6	6.0	25.00	23.00
SMS0850-1R0M	1.0	20%	4.1	5.5	20.00	19.00
SMS0850-1R5M	1.5	20%	5.0	7.0	19.00	17.00
SMS0850-2R2M	2.2	20%	8.2	12.0	16.00	14.00
SMS0850-3R3M	3.3	20%	11.0	15.0	13.00	12.00
SMS0850-4R7M	4.7	20%	15.0	20.0	12.00	9.50
SMS0850-5R6M	5.6	20%	25.0	28.5	11.00	9.00
SMS0850-100M	10	20%	35.0	45.0	8.00	6.20
SMS0850-150M	15	20%	55.0	65.0	7.00	5.40
SMS0850-220M	22	20%	78.0	88.0	5.50	4.80
SMS0850-330M	33	20%	120.0	140.0	6.00	3.50
SMS0850-470M	47	20%	177.0	190.0	4.00	2.90
SMS0850-560M	56	20%	188.0	226.0	3.00	2.50
SMS0850-680M	68	20%	280.0	310.0	2.80	2.00

Notes:

Saturation Current: DC current at which inductance drops 30% from its value without current.
Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current: The lesser of Isat or Irms.
Part temperature should be verified in the end application due to factors like circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions.

Packaging

Part No.	Tape Dimension W (mm)	Tape Dimension P (mm)	Tape Dimension W1 (mm)	Reel Dimensions A (mm)	Reel Dimensions B (mm)	Reel Dimensions C (mm)	Reel Dimensions D (mm)	REEL (PCS)	Inside Box (PCS)	Outside Carton (PCS)
SMS0850	24.0	12.0	11.5	24.4	100	13	330	1000	2000	8000

Tape and Reel Specifications and dimensions are in mm.

Reliability Testing

Item	Requirements	Test Methods and Remarks
Terminal Strength (SMT)	Meet requirements without any loose terminal.	Pulling test based on sectional area of terminal (e.g., 8mm, 8mm20mm). Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s.
Terminal Strength (DIP)	Meet requirements without any loose terminal.	Applied force based on terminal diameter (d): 0.35d0.50 (5N), 0.50d0.80 (10N), 0.80d1.25 (20N), D1.25 (40N). Duration: 10sec.
Resistance to Flexure	No visible mechanical damage.	Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec.
Dropping	No case deformation or change in appearance. No short and no open.	Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability	Terminals must have 95% minimum solder coverage. Wetting shall exceed 75% coverage.	Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol.
Vibration	No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.	Frequency varied between 10 and 55 Hz. Applied for 2 hours in each of 3 mutually perpendicular directions (total 6 hours).
Thermal Shock	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	100 cycles of temperature cycling between (85~125) and (-55~40). Transforming interval: Max. 20 sec.
Low temperature Storage	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	Temperature: -55~-402. Duration: 962 hours.
High temperature Storage	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	Temperature: 125~852. Duration: 962 hours.
Damp Heat (Steady States)	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours.
Heat endurance of Reflow soldering	No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%.	Reflow twice. Peak temperature: 260+0/-5.
Resistance to solvent test	No case deformation or change in appearance or obliteration of marking.	Dip parts into IPA solvent for 50.5Min, then drying at room temp for 5Min, brushing 10 times.
Overload test	During test no smoke, no peculiar smell, no fire. Characteristics normal after test.	Apply twice rated current for 5 minutes.
Voltage resistance test	During test no breakdown. Characteristics normal after test.	DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils).

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment/equipment.

Reminders for Using These Products

Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Terminal solderability may deteriorate past storage time.
Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
Handling: Avoid direct contact with terminals with bare hands due to oils affecting solderability. Handle products carefully to prevent damage from dropping or improper removal.
Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
Magnetic Fields: Do not expose products to magnets or magnetic fields.
Preheating: Preheat components before soldering; ensure the temperature difference between solder and chip temperature does not exceed 150C.
Soldering Corrections: Perform post-mounting soldering corrections within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
Thermal Design: Allow sufficient margin for thermal design due to self-heating when power is applied.
Non-Magnetic Shield Type: Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.

2410121647_LanTu-Micro-SMS0850-4R7MT_C7602864.pdf

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