LanTu Micro SMS0865 4R7MT power inductor featuring low parasitic capacitance and high current capability

Product Overview

The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0865 Series is an ultra-high current SMD power inductor designed for high-density installations. Featuring a thin profile with low DC resistance and ultra-high current capabilities, these magnetic shielding type inductors offer strong anti-electromagnetic interference. Their integral construction ensures high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. Utilizing low-loss alloy powder die-casting, these inductors achieve low impedance and small parasitic capacitance, contributing to high efficiency by reducing winding DC resistance and core eddy-current loss. They are suitable for applications requiring up to 75VDC absolute maximum voltage and comply with RoHS, Halogen Free, and REACH standards.

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Product Type: Molding SMD Power Inductor
• Series: SMS0865
• Certifications: RoHS, Halogen Free, REACH Compliance
• Origin: Shenzhen, China (implied by company name and location)

Technical Specifications

Applications

• PDA, notebook, desktop, server applications
• High current POL converters
• Battery powered devices
• DC/DC converters in distributed power systems

Test Equipment

• Inductance (L): WK3260B LCR meter or equivalent
• Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification

SMS 0865 - 100 M T

• SMS: Molding SMD Power Inductor
• 0865: External Dimensions (LWH) (mm) 9.08.16.5
• 100: Inductance (e.g., 100 = 10 H)
• M: Inductance Tolerance (20%)
• T: Packing (Tape & Reel)

Packaging

• Packing Options: Bulk Package (B), Tape & Reel (T)

Reliability Testing Summary

• Terminal Strength
• Resistance to Flexure
• Dropping Test
• Solderability
• Vibration Test
• Thermal Shock
• Low Temperature Storage
• High Temperature Storage
• Damp Heat (Steady States)
• Heat endurance of Reflow soldering
• Resistance to solvent test
• Overload test
• Voltage resistance test

Recommended Reflow Soldering Curve

Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific user equipment and process conditions.

Reminders for Using These Products

• Storage period: within 12 months; conditions: 5~40C, 35~65% RH.
• Avoid use and storage in corrosive environments (salt, acid, alkali, etc.).
• Do not touch electrodes directly with bare hands.
• Handle products carefully to prevent damage.
• Do not bend terminals excessively.
• Do not rinse coils; contact the manufacturer if cleaning is necessary.
• Do not expose products to magnets or magnetic fields.
• Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
• Soldering corrections after mounting should be within specified conditions to avoid overheating.
• Allow sufficient thermal design margin for self-heating during operation.
• For non-magnetic shield types, careful coil layout is needed to prevent malfunctions due to magnetic interference.